SS1H10-E3/61T产品概述
Features:
Low Profile Package
Ideal for Automated Placement
Guardring for Overvoltage Protection
Low Power Losses, High Efficiency
Low Forward Voltage Drop
High Surge Capability
Meets MSL Level 1, Per J-STD-020, LF Maximum Peak of 260°C
Solder Dip 260°C, 40 s
Component in Accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
Applications:
For use in low voltage, high frequency inverters, freewheeling, dc-to-dc converters, and polarity protection applications.
Datasheet
