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Kester 959 is a no-clean, non-corrosive, liquid flux that is designed for the wave soldering of conventional and surface mount circuit board assemblies. Kester 959 was developed to minimize the formation of micro-solderballs during wave soldering operations. This flux contains a small percentage of rosin (1%), which improves solderability, heat stability and surface insulation resistance. Kester 959 offers the best wetting and the shiniest solder joints of any no-clean, solvent-based chemistry. Kester 959 leaves evenly distributed residues for the best cosmetic appearance.

Brand/Series	63 Series
Chemical Component	Specific Gravity: 0.810 ± 0.005<br />Antoine Paar DMA 35 @ 25°C<br />Percent Solids (typical): 3.9<br />Tested to J-STD-004, IPC-TM-650, Method 2.3.34<br />Acid Number: 21.8 ± 1.5 mg KOH/g of flux<br />Tested to J-STD-004, IPC-TM-650, Method 2.3.13<br />pH (10% solution): 4.6<br />Hanna Instruments 8314 @ 25°C<br />Thinner: 4662
Type	Low-Solids No-Clean Liquid Flux
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Brand/Series 63 Series  NTE Electronics, Inc. Brand/Series 63 Series  Flux Brand/Series 63 Series  NTE Electronics, Inc. Flux Brand/Series 63 Series   Chemical Component Specific Gravity: 0.810 ± 0.005<br />Antoine Paar DMA 35 @ 25°C<br />Percent Solids (typical): 3.9<br />Tested to J-STD-004, IPC-TM-650, Method 2.3.34<br />Acid Number: 21.8 ± 1.5 mg KOH/g of flux<br />Tested to J-STD-004, IPC-TM-650, Method 2.3.13<br />pH (10% solution): 4.6<br />Hanna Instruments 8314 @ 25°C<br />Thinner: 4662  NTE Electronics, Inc. Chemical Component Specific Gravity: 0.810 ± 0.005<br />Antoine Paar DMA 35 @ 25°C<br />Percent Solids (typical): 3.9<br />Tested to J-STD-004, IPC-TM-650, Method 2.3.34<br />Acid Number: 21.8 ± 1.5 mg KOH/g of flux<br />Tested to J-STD-004, IPC-TM-650, Method 2.3.13<br />pH (10% solution): 4.6<br />Hanna Instruments 8314 @ 25°C<br />Thinner: 4662  Flux Chemical Component Specific Gravity: 0.810 ± 0.005<br />Antoine Paar DMA 35 @ 25°C<br />Percent Solids (typical): 3.9<br />Tested to J-STD-004, IPC-TM-650, Method 2.3.34<br />Acid Number: 21.8 ± 1.5 mg KOH/g of flux<br />Tested to J-STD-004, IPC-TM-650, Method 2.3.13<br />pH (10% solution): 4.6<br />Hanna Instruments 8314 @ 25°C<br />Thinner: 4662  NTE Electronics, Inc. Flux Chemical Component Specific Gravity: 0.810 ± 0.005<br />Antoine Paar DMA 35 @ 25°C<br />Percent Solids (typical): 3.9<br />Tested to J-STD-004, IPC-TM-650, Method 2.3.34<br />Acid Number: 21.8 ± 1.5 mg KOH/g of flux<br />Tested to J-STD-004, IPC-TM-650, Method 2.3.13<br />pH (10% solution): 4.6<br />Hanna Instruments 8314 @ 25°C<br />Thinner: 4662   Type Low-Solids No-Clean Liquid Flux  NTE Electronics, Inc. Type Low-Solids No-Clean Liquid Flux  Flux Type Low-Solids No-Clean Liquid Flux  NTE Electronics, Inc. Flux Type Low-Solids No-Clean Liquid Flux