4900P-25G -
Solder Paste, SAC305, 96.6% tin, 0.7% copper, 3% Silver, LEAD FREE, No Clean
- 制造商产品编号：
- 4900P-25G
- 仓库库存编号：
- 70377411
由于产品数据库庞大，部分产品信息可能未能及时更新，下单前请与销售人员确认好实时在库数量，谢谢合作！
4900P-25G产品概述
MG 4900P Lead Free Solder Paste
MG Chemicals has developed a unique flux system designed specifically for high temperature lead free alloys. It provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere (normal). Since use of nitrogen is not required, MG 4900P Lead Free Solder paste will provide excellent cost savings. MG 4900P Lead Free solder paste exhibits superior joint strength, excellent wettability and extraordinary print definition and tack life. The post soldering residues of MG 4900P are non-conductive, non-corrosive and highly insulated.
Datasheet
