151105-0001产品概述
Angled, Ultra Low-profile, Aerodynamic and Standard
DDR4 DIMM sockets combine excellent performance with maximum space-savings and assembly processing for high-speed data and networking applications.
Features
25° angle inclination to the horizontal (Angled version) gives up to 45% vertical space savings over standard vertical versions.
Ultra-low seating plane of 1.10mm (Ultra low-profile version)frees up vertical module space to allow use of highdensity DIMMs while maintaining the same design height; Enables the use of very low-profile modules with seating heights below 2.80mm (maximum) in ATCA* blade systems.
Lower current of 0.75A per terminal compared to 1.0A for ULP DDR3 DIMM versions for bigger energy cost savings.
Streamlined housing and latch design (Aerodynamic series) minimizes trapping of hot air around high-density memory modules during operation.
Metal-reinforced latch tower housing (Angled, Aerodynamic and Standard series) prevents cleavage or separation of tower bridge due to wear and tear.
Multiple soldertail length options available for Throughhole and Press-fit sockets (Aerodynamic and Standard series) to suit various PCB thicknesses.
Flush soldertail design for SMT socket (Standard series only) minimizes accidental damage to terminals due to bending.
Anti-stubbing mating contacts (All series) provide smooth module lead-in and contact grip during insertion."
Datasheet
