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TP0002 - 

Theremo Pad; 0.50C/W Thermal Resistance; Silicon/Fibre Glass; Gray

NTE Electronics, Inc. TP0002
声明:图片仅供参考,请以实物为准!
制造商产品编号:
TP0002
仓库库存编号:
70215873
技术数据表:
View TP0002 Datasheet Datasheet
订购热线: 400-900-3095  0755-21000796, QQ:800152669, Email:sales@szcwdz.com
由于产品数据库庞大,部分产品信息可能未能及时更新,下单前请与销售人员确认好实时在库数量,谢谢合作!

TP0002产品概述

NTE's THERMO-PADS do away with the old fashioned and messy mica wafer and conductive grease method of mounting power semiconductors. These thermally conductive insulators offer low heat transfer resistance while still providing high electrical isolation between the parts of the assembly. The elastomeric material combines the electrical isolation of rigid insulators with the ability to conform to rough surfaces and reduce contact resistance in much the same manner as thermal greases. Proper selection and use of these thermo-pads results in a securely mounted power semiconductor and minimum resistance to the heat transfer between it and the heat sink. Typical Properties Color: Gray; Test Method — Visual. Breaking Strength, Lbs./Inch: 100; Test Method — ASTM D 1458. Elongation, Percent: 4; Test Method — ASTM D 412. Volume Resistance Ohm Metre Minimum Normal: 1.0 × 1013, Test Method — ASTM D 257. Volume Resistance Ohm Metre Minimum Moist: 1.5 × 1010, Test Method — ASTM D 257. Breakdown Voltage, Minimum Normal: 5000; Test Method — ASTM D 149. Moist: 2500; Test Method — ASTM D 149. Dielectric Constant 1000 Cups (Hz): 5.5; Test Method — ASTM D 150. Continuous Use Temp. °C: –60 to +180. Thermal Conductance W/m-k: 0.7. Thermal Vacuum Weight Loss Percent (TML) Maximum As Manufactured: 0.40; Test Method — NASA. Thermal Vacuum Weight Loss Percent (TML) Maximum Post Cure 24 Hrs @ 400°F: 0.25; Test method — SP-R-0022A. Volatile Condensable Material, Percent, Maximum (CVCM) as Manufactured: 0.11; Test Method — NASA. Volatile Condensable Material, Percent, Maximum (CVCM) Post Cure 24 Hrs. @ 400°F: 0.07; Test Method — SP-R-0022A. Hardness, Shore A: 85; Test Method — ASTM D 2240. Specific Gravity: 2.0-2.1. Thickness (Expressed In Inches): 0.009 (+0.002, –0.001). Thermal Resistance (TO-3 Transistor) °C/Watt: 0.50.

TP0002产品信息

  Brand/Series  TP Series  
  Color  Gray  
  Dielectric Constant  5.5  
  Dimensions  1.312 L x 0.762 W In.  
  Hardness  85 Shore A  
  Material  Silicone/Fiberglass  
  Package Type  TO-66  
  Temperature, Continuous Use  -60 to 180 °C  
  Thermal Conductivity  0.9 W/m-K  
  Thickness  0.009 In.  
  Type  Thermal Pads  
  Voltage, Breakdown  4500 VAC  
关键词         

TP0002相关搜索

Brand/Series TP Series  NTE Electronics, Inc. Brand/Series TP Series  Thermal Pads Brand/Series TP Series  NTE Electronics, Inc. Thermal Pads Brand/Series TP Series   Color Gray  NTE Electronics, Inc. Color Gray  Thermal Pads Color Gray  NTE Electronics, Inc. Thermal Pads Color Gray   Dielectric Constant 5.5  NTE Electronics, Inc. Dielectric Constant 5.5  Thermal Pads Dielectric Constant 5.5  NTE Electronics, Inc. Thermal Pads Dielectric Constant 5.5   Dimensions 1.312 L x 0.762 W In.  NTE Electronics, Inc. Dimensions 1.312 L x 0.762 W In.  Thermal Pads Dimensions 1.312 L x 0.762 W In.  NTE Electronics, Inc. Thermal Pads Dimensions 1.312 L x 0.762 W In.   Hardness 85 Shore A  NTE Electronics, Inc. Hardness 85 Shore A  Thermal Pads Hardness 85 Shore A  NTE Electronics, Inc. Thermal Pads Hardness 85 Shore A   Material Silicone/Fiberglass  NTE Electronics, Inc. Material Silicone/Fiberglass  Thermal Pads Material Silicone/Fiberglass  NTE Electronics, Inc. Thermal Pads Material Silicone/Fiberglass   Package Type TO-66  NTE Electronics, Inc. Package Type TO-66  Thermal Pads Package Type TO-66  NTE Electronics, Inc. Thermal Pads Package Type TO-66   Temperature, Continuous Use -60 to 180 °C  NTE Electronics, Inc. Temperature, Continuous Use -60 to 180 °C  Thermal Pads Temperature, Continuous Use -60 to 180 °C  NTE Electronics, Inc. Thermal Pads Temperature, Continuous Use -60 to 180 °C   Thermal Conductivity 0.9 W/m-K  NTE Electronics, Inc. Thermal Conductivity 0.9 W/m-K  Thermal Pads Thermal Conductivity 0.9 W/m-K  NTE Electronics, Inc. Thermal Pads Thermal Conductivity 0.9 W/m-K   Thickness 0.009 In.  NTE Electronics, Inc. Thickness 0.009 In.  Thermal Pads Thickness 0.009 In.  NTE Electronics, Inc. Thermal Pads Thickness 0.009 In.   Type Thermal Pads  NTE Electronics, Inc. Type Thermal Pads  Thermal Pads Type Thermal Pads  NTE Electronics, Inc. Thermal Pads Type Thermal Pads   Voltage, Breakdown 4500 VAC  NTE Electronics, Inc. Voltage, Breakdown 4500 VAC  Thermal Pads Voltage, Breakdown 4500 VAC  NTE Electronics, Inc. Thermal Pads Voltage, Breakdown 4500 VAC  
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