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Ohmite D Series heatsinks provide an innovative solution for SMT compatible semiconductors and resistors. The unique design (Patent Pending) combines tin plated, solderable rods with an aluminum extruded heat sink body. These rods (or “rollers”) are mated mechanically to the heatsink by forging to reduce the thermal resistance between the heatsink body and the solderable feet. Specifically designed for use with the increasingly popular TO-252, TO-263 and TO-268 packages, the D Series affords the user superior thermal performance over the more common stamped aluminum heatsinks. By eliminating the staking joint typically used in stamped heatsinks, the resulting air gap and thermal “bottleneck” is also eliminated, while surface area for cooling is maximized with the extruded fins of the D Series body.

Brand/Series	D Series
Finish	Degreased
For Use With	TO-268
Material	Aluminum Alloy
Thermal Resistance	4 °C/W
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Brand/Series D Series  Ohmite Brand/Series D Series  Heatsinks Brand/Series D Series  Ohmite Heatsinks Brand/Series D Series   Finish Degreased  Ohmite Finish Degreased  Heatsinks Finish Degreased  Ohmite Heatsinks Finish Degreased   For Use With TO-268  Ohmite For Use With TO-268  Heatsinks For Use With TO-268  Ohmite Heatsinks For Use With TO-268   Material Aluminum Alloy  Ohmite Material Aluminum Alloy  Heatsinks Material Aluminum Alloy  Ohmite Heatsinks Material Aluminum Alloy   Thermal Resistance 4 °C/W  Ohmite Thermal Resistance 4 °C/W  Heatsinks Thermal Resistance 4 °C/W  Ohmite Heatsinks Thermal Resistance 4 °C/W