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Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers' component thermal specifications.

Application	Board Level Power Semiconductors
Brand/Series	217 Series
Color	Metal
Convection, Forced	16°C/W @ 200 LFM
Convection, Natural	55°C @ 1 W
Dimensions	0.6 x 0.75 in.
Finish	Tin
For Use With	TO-263
Height, Above PC Board	0.39 in.
Material	Copper
Package Type	TO-220
Primary Type	D<sup>2</sup>PAK/TO-220/SOT-223/SOL-20
Resistance, Thermal	16 °C/W
Special Features	Surface Mount, No Interface Material is Needed, EIA Standards, ESD Protection
Thermal Resistance	16.0 °C/W
Type	Press-Fit
关键词

Application Board Level Power Semiconductors  Wakefield Application Board Level Power Semiconductors  Heatsinks Application Board Level Power Semiconductors  Wakefield Heatsinks Application Board Level Power Semiconductors   Brand/Series 217 Series  Wakefield Brand/Series 217 Series  Heatsinks Brand/Series 217 Series  Wakefield Heatsinks Brand/Series 217 Series   Color Metal  Wakefield Color Metal  Heatsinks Color Metal  Wakefield Heatsinks Color Metal   Convection, Forced 16°C/W @ 200 LFM  Wakefield Convection, Forced 16°C/W @ 200 LFM  Heatsinks Convection, Forced 16°C/W @ 200 LFM  Wakefield Heatsinks Convection, Forced 16°C/W @ 200 LFM   Convection, Natural 55°C @ 1 W  Wakefield Convection, Natural 55°C @ 1 W  Heatsinks Convection, Natural 55°C @ 1 W  Wakefield Heatsinks Convection, Natural 55°C @ 1 W   Dimensions 0.6 x 0.75 in.  Wakefield Dimensions 0.6 x 0.75 in.  Heatsinks Dimensions 0.6 x 0.75 in.  Wakefield Heatsinks Dimensions 0.6 x 0.75 in.   Finish Tin  Wakefield Finish Tin  Heatsinks Finish Tin  Wakefield Heatsinks Finish Tin   For Use With TO-263  Wakefield For Use With TO-263  Heatsinks For Use With TO-263  Wakefield Heatsinks For Use With TO-263   Height, Above PC Board 0.39 in.  Wakefield Height, Above PC Board 0.39 in.  Heatsinks Height, Above PC Board 0.39 in.  Wakefield Heatsinks Height, Above PC Board 0.39 in.   Material Copper  Wakefield Material Copper  Heatsinks Material Copper  Wakefield Heatsinks Material Copper   Package Type TO-220  Wakefield Package Type TO-220  Heatsinks Package Type TO-220  Wakefield Heatsinks Package Type TO-220   Primary Type D²PAK/TO-220/SOT-223/SOL-20  Wakefield Primary Type D²PAK/TO-220/SOT-223/SOL-20  Heatsinks Primary Type D²PAK/TO-220/SOT-223/SOL-20  Wakefield Heatsinks Primary Type D²PAK/TO-220/SOT-223/SOL-20   Resistance, Thermal 16 °C/W  Wakefield Resistance, Thermal 16 °C/W  Heatsinks Resistance, Thermal 16 °C/W  Wakefield Heatsinks Resistance, Thermal 16 °C/W   Special Features Surface Mount, No Interface Material is Needed, EIA Standards, ESD Protection  Wakefield Special Features Surface Mount, No Interface Material is Needed, EIA Standards, ESD Protection  Heatsinks Special Features Surface Mount, No Interface Material is Needed, EIA Standards, ESD Protection  Wakefield Heatsinks Special Features Surface Mount, No Interface Material is Needed, EIA Standards, ESD Protection   Thermal Resistance 16.0 °C/W  Wakefield Thermal Resistance 16.0 °C/W  Heatsinks Thermal Resistance 16.0 °C/W  Wakefield Heatsinks Thermal Resistance 16.0 °C/W   Type Press-Fit  Wakefield Type Press-Fit  Heatsinks Type Press-Fit  Wakefield Heatsinks Type Press-Fit