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With fins oriented vertically in cabinet sidewall applications, 401 and 403 Series heat sinks are recommended for critical space applications where maximum heat dissipation is required for high-power TO-3 case styles. Forced convection performance is also exemplary with these double surface fin types. Semiconductor mounting hole style F offers a single centered 0.270 in. (6.9)-diameter mounting hole (with a 0.750 in. (19.1)-diameter area free of anodize) for mounting stud-type diodes and rectifiers. Hole pattern V available upon request. Material: Aluminum Alloy, Black Anodized.

Brand/Series	401 Series
For Use With	TO-3
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Brand/Series 401 Series  Wakefield Brand/Series 401 Series  Heatsinks Brand/Series 401 Series  Wakefield Heatsinks Brand/Series 401 Series   For Use With TO-3  Wakefield For Use With TO-3  Heatsinks For Use With TO-3  Wakefield Heatsinks For Use With TO-3