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Achieve optimum natural convection cooling per unit volume occupied above the printed circuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style cases, when this low-cost heat sink is used. Any mounting attitude will provide free circulation of air in natural convection applications. These 680 Series heat sinks can also be specified without any semiconductor mounting hole pattern by specifying suffix K (Example: 680-5K).

Application	Board Level Power Semiconductors
Brand/Series	680 Series
Color	Black
Configuration	Horizontal
Convection, Forced	1.5°C/W @ 400 LFM
Convection, Natural	46°C @ 7.5 W
Dimensions	1.81 Square in.
Finish	Black Anodized
For Use With	TO-3, TO-220
Height, Above PC Board	1.25 in.
Material	Aluminum
Mounting Style	Horizontal
Package Type	TO-3
Primary Type	TO-220/TO-3
Resistance, Thermal	1.5 °C/W
Special Features	Maximum Efficiency Omnidirectional Heat Sink
Thermal Resistance	1.5 °C/W
Type	Board Level
Weight	49.9 g
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• HVCA
  DIODE; 1 A (MAX.) @ 25C IF; 1.1 V (MAX.) @ 25C; 5 UADC (MAX.) @ 25C IR
  
  型号：1N4005
  仓库库存编号：70015971
  
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• TE Connectivity
  AMP; RECEPTACLE; 22-18AWG; DIMPLE W/WIRE STOP; TIN PLATED BRASS
  
  型号：640917-1
  仓库库存编号：70084041
  
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• TE Connectivity
  AMP; RECEPTACLE; 16-14AWG; DIMPLE W/WIRE STOP; TIN PLATED BRASS
  
  型号：640905-1
  仓库库存编号：70084047
  
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• TE Connectivity
  AMP; RECEPTACLE; 16-14AWG; DIMPLE W/WIRE STOP; TIN PLATED BRASS
  
  型号：640905-1
  仓库库存编号：70084047
  
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• TE Connectivity
  AMP; RECEPTACLE; 16-14AWG; DIMPLE W/WIRE STOP; TIN PLATED BRASS
  
  型号：640905-1
  仓库库存编号：70084047
  
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• TE Connectivity
  TERMINAL, RING TONGUE, PIDG, 22-16 AWG (MIL 4), STRAIGHT, CLOSED BARREL
  
  型号：320882
  仓库库存编号：70085070
  
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• Molex Incorporated
  KK Crimp Terminal 4366, 18-24 AWG, Bag Tin (Sn)
  
  型号：08-03-0304
  仓库库存编号：70090934
  
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• Bourns
  RF Choke; Hash; 100uH; 2Adc; 20%; 0.216 OhmsDCR; 1.25In.L
  
  型号：5250-RC
  仓库库存编号：70154368
  
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• RCD Components
  Resistor; Carbon Film; Res 100 Ohms; Pwr-Rtg 0.5 W; Tol 5%; Axial
  
  型号：CF50S-101-JTW
  仓库库存编号：70183430
  
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• Mill-Max
  Socket, DIP; 8Pins; Low Profile; Open; Solder Tail; 0.3In.; Beryllium Copper; Tin/Lead
  
  型号：110-93-308-41-001000
  仓库库存编号：70206181
  
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Application Board Level Power Semiconductors  Wakefield Application Board Level Power Semiconductors  Heatsinks Application Board Level Power Semiconductors  Wakefield Heatsinks Application Board Level Power Semiconductors   Brand/Series 680 Series  Wakefield Brand/Series 680 Series  Heatsinks Brand/Series 680 Series  Wakefield Heatsinks Brand/Series 680 Series   Color Black  Wakefield Color Black  Heatsinks Color Black  Wakefield Heatsinks Color Black   Configuration Horizontal  Wakefield Configuration Horizontal  Heatsinks Configuration Horizontal  Wakefield Heatsinks Configuration Horizontal   Convection, Forced 1.5°C/W @ 400 LFM  Wakefield Convection, Forced 1.5°C/W @ 400 LFM  Heatsinks Convection, Forced 1.5°C/W @ 400 LFM  Wakefield Heatsinks Convection, Forced 1.5°C/W @ 400 LFM   Convection, Natural 46°C @ 7.5 W  Wakefield Convection, Natural 46°C @ 7.5 W  Heatsinks Convection, Natural 46°C @ 7.5 W  Wakefield Heatsinks Convection, Natural 46°C @ 7.5 W   Dimensions 1.81 Square in.  Wakefield Dimensions 1.81 Square in.  Heatsinks Dimensions 1.81 Square in.  Wakefield Heatsinks Dimensions 1.81 Square in.   Finish Black Anodized  Wakefield Finish Black Anodized  Heatsinks Finish Black Anodized  Wakefield Heatsinks Finish Black Anodized   For Use With TO-3, TO-220  Wakefield For Use With TO-3, TO-220  Heatsinks For Use With TO-3, TO-220  Wakefield Heatsinks For Use With TO-3, TO-220   Height, Above PC Board 1.25 in.  Wakefield Height, Above PC Board 1.25 in.  Heatsinks Height, Above PC Board 1.25 in.  Wakefield Heatsinks Height, Above PC Board 1.25 in.   Material Aluminum  Wakefield Material Aluminum  Heatsinks Material Aluminum  Wakefield Heatsinks Material Aluminum   Mounting Style Horizontal  Wakefield Mounting Style Horizontal  Heatsinks Mounting Style Horizontal  Wakefield Heatsinks Mounting Style Horizontal   Package Type TO-3  Wakefield Package Type TO-3  Heatsinks Package Type TO-3  Wakefield Heatsinks Package Type TO-3   Primary Type TO-220/TO-3  Wakefield Primary Type TO-220/TO-3  Heatsinks Primary Type TO-220/TO-3  Wakefield Heatsinks Primary Type TO-220/TO-3   Resistance, Thermal 1.5 °C/W  Wakefield Resistance, Thermal 1.5 °C/W  Heatsinks Resistance, Thermal 1.5 °C/W  Wakefield Heatsinks Resistance, Thermal 1.5 °C/W   Special Features Maximum Efficiency Omnidirectional Heat Sink  Wakefield Special Features Maximum Efficiency Omnidirectional Heat Sink  Heatsinks Special Features Maximum Efficiency Omnidirectional Heat Sink  Wakefield Heatsinks Special Features Maximum Efficiency Omnidirectional Heat Sink   Thermal Resistance 1.5 °C/W  Wakefield Thermal Resistance 1.5 °C/W  Heatsinks Thermal Resistance 1.5 °C/W  Wakefield Heatsinks Thermal Resistance 1.5 °C/W   Type Board Level  Wakefield Type Board Level  Heatsinks Type Board Level  Wakefield Heatsinks Type Board Level   Weight 49.9 g  Wakefield Weight 49.9 g  Heatsinks Weight 49.9 g  Wakefield Heatsinks Weight 49.9 g