| Brand/Series |
HEXFET Series |
|
| Capacitance, Input |
255 pF @ 25 V |
|
| Channel Mode |
Enhancement |
|
| Channel Type |
N |
|
| Configuration |
Dual Drain |
|
| Current, Drain |
3 A |
|
| Dimensions |
5.00 x 4.00 x 1.50 mm |
|
| Gate Charge, Total |
10 nC |
|
| Height |
0.059" (1.5mm) |
|
| Length |
0.196" (5mm) |
|
| Mounting Type |
Surface Mount |
|
| Number of Elements per Chip |
2 |
|
| Number of Pins |
8 |
|
| Package Type |
SO-8 |
|
| Polarization |
N-Channel |
|
| Power Dissipation |
2.4 W |
|
| Resistance, Drain to Source On |
200 mΩ |
|
| Temperature, Operating |
-55 to 150 °C |
|
| Temperature, Operating, Maximum |
+175 °C |
|
| Temperature, Operating, Minimum |
-55 °C |
|
| Temperature, Operating, Range |
-55 to +175 °C |
|
| Thermal Resistance, Junction to Ambient |
50 °C/W |
|
| Time, Turn-Off Delay |
15 ns |
|
| Time, Turn-On Delay |
5.1 ns |
|
| Transconductance, Forward |
3.4 S |
|
| Typical Gate Charge @ Vgs |
10 nC @ 10 V |
|
| Voltage, Breakdown, Drain to Source |
50 V |
|
| Voltage, Drain to Source |
50 V |
|
| Voltage, Forward, Diode |
1.2 V |
|
| Voltage, Gate to Source |
±20 V |
|
| Width |
0.157" (4mm) |
|
| 关键词 |