| Brand/Series |
HEXFET Series |
|
| Capacitance, Input |
650 pF @ 25 V (N), 710 pF @ -25 V (P) |
|
| Channel Mode |
Enhancement |
|
| Channel Type |
N, P |
|
| Configuration |
Dual Drain |
|
| Current, Drain |
-5.3 (P), 7.3 (N) A |
|
| Dimensions |
5.00 x 4.00 x 1.50 mm |
|
| Gate Charge, Total |
22/23 nC |
|
| Height |
0.059" (1.5mm) |
|
| Length |
0.196" (5mm) |
|
| Mounting Type |
Surface Mount |
|
| Number of Elements per Chip |
2 |
|
| Number of Pins |
8 |
|
| Package Type |
SO-8 |
|
| Polarization |
N-Channel and P-Channel |
|
| Power Dissipation |
2.5 W |
|
| Resistance, Drain to Source On |
0.046 (N), 0.098 (P) Ω |
|
| Temperature, Operating |
-55 to 150 °C |
|
| Temperature, Operating, Maximum |
+150 °C |
|
| Temperature, Operating, Minimum |
-55 °C |
|
| Temperature, Operating, Range |
-55 to +150 °C |
|
| Thermal Resistance, Junction to Ambient |
50 °C/W |
|
| Time, Turn-Off Delay |
26 (N), 34 (P) ns |
|
| Time, Turn-On Delay |
13 (P), 8.1 (N) ns |
|
| Transconductance, Forward |
14 (N), 7.7 (P) S |
|
| Typical Gate Charge @ Vgs |
22 nC @ 10 V (N), 23 nC @ -10 V (P) |
|
| Voltage, Breakdown, Drain to Source |
30/-30 V |
|
| Voltage, Drain to Source |
-30 (P), 30 (N) V |
|
| Voltage, Forward, Diode |
0.78/-0.78 V |
|
| Voltage, Gate to Source |
±20 V |
|
| Width |
0.157" (4mm) |
|
| 关键词 |