| Brand/Series |
HEXFET Series |
|
| Capacitance, Input |
350 pF @ -25 V |
|
| Channel Mode |
Enhancement |
|
| Channel Type |
P |
|
| Configuration |
Dual Drain |
|
| Current, Drain |
-6.6 A |
|
| Dimensions |
6.73 x 6.22 x 2.39 mm |
|
| Gate Charge, Total |
27 nC |
|
| Height |
0.094" (2.39mm) |
|
| Length |
0.264" (6.73mm) |
|
| Mounting Type |
Surface Mount |
|
| Number of Elements per Chip |
1 |
|
| Number of Pins |
3 |
|
| Package Type |
DPAK |
|
| Polarization |
P-Channel |
|
| Power Dissipation |
40 W |
|
| Resistance, Drain to Source On |
0.48 Ω |
|
| Temperature, Operating, Maximum |
+150 °C |
|
| Temperature, Operating, Minimum |
-55 °C |
|
| Temperature, Operating, Range |
-55 to +150 °C |
|
| Time, Turn-Off Delay |
28 ns |
|
| Time, Turn-On Delay |
14 ns |
|
| Transconductance, Forward |
1.4 S |
|
| Typical Gate Charge @ Vgs |
Maximum of 27 nC @ -10 V |
|
| Voltage, Breakdown, Drain to Source |
-100 V |
|
| Voltage, Drain to Source |
-100 V |
|
| Voltage, Forward, Diode |
-1.6 V |
|
| Voltage, Gate to Source |
±20 V |
|
| Width |
0.245" (6.22mm) |
|
| 关键词 |